Electronic Circuit Board Assembly
Detailed Terms for electronic circuit board assembly：
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
Using Solder Paste: Similar to T-Shirt Shielding, solder paste stencils are applied to the part using a thin stainless steel stencil and then mounted on a printed circuit board. When using solder, a chemical called flux is used to help melt the solder paste and bond it to the board surface.
Picking and placing components: After using solder paste, the next step in the board assembly process is to pick and place the machine. This is where the surface mount components are placed on the printed circuit board. This process was previously done manually by the board assembler, who will use a pair of tweezers to pick and place the components. However, with the advent of robotics, this step was automated to achieve greater consistency and precision.
Soldering: After all components have been installed, place the printed circuit board on the conveyor and move the conveyor to the reflow oven. Inside the oven, the board is heated to melt the solder paste and permanently bond the components to the board itself. In the case where the board includes other components than the SMD, it may be necessary to insert the through hole member. However, in these cases, a more specialized welding method is required.
Testing and quality control: In some cases, movement of the printed circuit board during reflow can cause component misalignment, resulting in poor connections, no connections at all, or incorrect component connections. This is the importance of checking and performing some tests to ensure board functionality. Even if all the above steps have been carefully done, the board may not pass the functional test. A failed printed circuit board can be scrapped or recycled, and the process will start over until the end result is a fully functional printed circuit board.
The development trend of electronic circuit board assembly:
The packaging of electronic components is getting smaller and smaller, and 0402 and even 0201 materials are gradually becoming popular. This poses new challenges to the process requirements of PCBA chip processing. It needs to be equipped with high-precision SMT placement machine, precise laser steel mesh and welding process. Wait. In addition, in the design process of the PCBA board, the conversion of the plug-in material to the patch material has gradually become the mainstream. The production of the plug-in requires more manual input, the cost is higher, and the consistency of the product is not welded in the form of a patch package. Good consistency.
The trend of PCBA chip processing is constantly evolving. In the future, the increase of labor costs and the popularization of intelligent manufacturing concepts, PCBA processing begins to show high-end intelligence, automation, miniaturization and other trends, thus achieving high production efficiency. In this development trend, the entire industry base needs to be continuously upgraded, from components and SMT placement machines to production processes.
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