PCB Assembly Reliability Test

PCB Assembly Reliability Test
Product Details

PCB Assembly Reliability Test:



Reliability&Repeatability

Ensuring assembly reliability and PCB repeatability requires experience and rigorous testing. Identifying defects that can cause failures is critical to maintaining quality, and is usually online (ICT), which can be detected by functional tests. However, some defects such as insufficient or excessive solder, edge connectors, open power pins or misaligned components cannot be detected using this method.


Thermal Analysis

Thermal analysis accurately locates the temperature in different areas of the top and bottom of the reflow oven and determines the temperature profile that best fits the board based on its complexity and structure. The correct temperature profile depends on factors such as the number of ground planes on the multilayer board, and the contour complexity is based on the number of components and their density distributed across the board.


Thermal analysis has two important goals: 1. Determine the exact process settings for a particular board assembly; 2. Ensure repeatable results by verifying process consistency. Inaccurate heat distribution can result in poor solder joints and can damage components, and failure to verify compliance can cause PCBs or components to miss reliability targets.


ICT Test

The most cumbersome, cumbersome and expensive of all PCB tests is the ICT test. The fixtures required for ICT testing can take four to six weeks to complete, ranging from $10,000 to $50,000. What is worth investing in is its value in testing large quantities of mature products. It checks the voltage levels and resistance of individual nodes and accurately detects parameter and component failures as well as PCB design related faults.


Test board operation and behavior involve functional testing, during which the PCB is affected by a range of signals and supply voltages. Monitor the response at various points to verify that the board is functioning properly. This test is usually specified by an engineer with a defined test program. It is a great way to detect functional and parametric faults as well as incorrect component values.


If your project only requires prototypes, you may not want to generate expensive ICT equipment and can safely rely on basic flying probe testing or power-up testing. However, for projects involving mature PCB designed for DFT systems with long product life, ICT testing is most likely to be indicated and you will need to pay a premium for this. Faults are found at each test stage, however, the printed circuit boards that pass the final ICT test and pass will certainly work flawlessly.

Ensuring assembly reliability and PCB repeatability requires experience and rigorous testing. Identifying defects that can cause failures is critical to maintaining quality, and is usually online (ICT), which can be detected by functional tests. However, some defects such as insufficient or excessive solder, edge connectors, open power pins or misaligned components cannot be detected using this method.


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