Smt Smd Pcba

Product Details

PCB Assembly SMT & SMD manufacturing Capabilities

-Quantity: Prototype, Low, Medium, High Volume PCB Assembly

-Type of Assembly: SMT, Thru-hole, Cable assembly, Wire Harness

-Min. IC Pitch: 0.30mm

-Foot Pin: SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA

-Min. Chip Placement: 1005

-Max. PCB Size: 410 x 600mm

-Min. PCB Thickness: 0.35mm

-Maximum BGA Size: 74 x 74mm

-BGA Ball Pitch: 1mm ~ 3mm

-BGA Ball Diameter: 0.4mm ~ 1mm

-QFP Lead Pitch: 0.38mm ~ 2.54mm

-Solder Type: Water Soluble Solder, Lead-Free, Wave soldering

-Components: 1) Passive Down to 0201 size BGA and VFBGA

2) Leadless Chip Carriers/CSP/QFN

3) Double-sided SMT Assembly

4）Fine Pitch to 0.8mils

5）BGA Repair and Reball

6）Part Removal and Replacement

-File Format:

1) Bill of Materials

2) Gerber files

3) Pick-N-Place file

-Types of Service: Turn-key, Partial turn-key or consignment, pilot run

-Component packaging: Cut Tape, Tube ,Reels, Loose Parts

-Turn Time: Same day service to 15 days service

-Programing: Hex file or bin file firmware.

-Testing: Flying Probe Test, X-ray Inspection AOI Test

-Package: Anti-static Bubble Bag & Carton

-PCB assembly process: IQC for incoming materials checking----Material baking----SMT----- Semi-Products Testing & QC ---DIP parts -- IPQC--- Wave Soldering--Semi-Products Testing & QC-----Assembling-----ICT or Xray-----100% Function Testing-----Reliability Testing (burn-testing) - Package - Shipping

Product Description