Smt Smd Pcba

PCB Assembly SMT & SMD manufacturing Capabilities
-Quantity: Prototype, Low, Medium, High Volume PCB Assembly
-Type of Assembly: SMT, Thru-hole, Cable assembly, Wire Harness
-Min. IC Pitch: 0.30mm
-Foot Pin: SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
-Min. Chip Placement: 1005
-Max. PCB Size: 410 x 600mm
-Min. PCB Thickness: 0.35mm
-Maximum BGA Size: 74 x 74mm
-BGA Ball Pitch: 1mm ~ 3mm
-BGA Ball Diameter: 0.4mm ~ 1mm
-QFP Lead Pitch: 0.38mm ~ 2.54mm
-Solder Type: Water Soluble Solder, Lead-Free, Wave soldering
-Components: 1) Passive Down to 0201 size BGA and VFBGA
2) Leadless Chip Carriers/CSP/QFN
3) Double-sided SMT Assembly
4)Fine Pitch to 0.8mils
5)BGA Repair and Reball
6)Part Removal and Replacement
-File Format:
1) Bill of Materials
2) Gerber files
3) Pick-N-Place file
-Types of Service: Turn-key, Partial turn-key or consignment, pilot run
-Component packaging: Cut Tape, Tube ,Reels, Loose Parts
-Turn Time: Same day service to 15 days service
-Programing: Hex file or bin file firmware.
-Testing: Flying Probe Test, X-ray Inspection AOI Test
-Package: Anti-static Bubble Bag & Carton
-PCB assembly process: IQC for incoming materials checking----Material baking----SMT----- Semi-Products Testing & QC ---DIP parts -- IPQC--- Wave Soldering--Semi-Products Testing & QC-----Assembling-----ICT or Xray-----100% Function Testing-----Reliability Testing (burn-testing) - Package - Shipping
Product Description
Products application
-Household appliance
-Medical products
-Automotive products
-Industrial products
-Consumer electronics
Factory View
Packaging & Shipping
.Packaging Details: Inner packing: Vacuum packing / Plastic bag
.Outer packing: Standard carton packing (As per customer's requirements)
.Delivery Detail: 1-3weeks depends on quantity
.Shipping: As per customer's requirements